Any combination of two systems; ALD, Sputtering, Evaporation, Ion Beam Milling or Etching, RIE, PECVD found in the NM catalog can be configurated as dual system. Cost is cut by sharing pumping systems and power supplies when applicable. The chambers are isolated from each other via gate valves and can be pumped and vented individually. Load lock or in vacuum chamber-to-chamber transfer is available.