Sputtering Systems can be constructed with various chamber and source configurations to efficiently deposit metal and dielectric thin films on to substrates up to 200 mm. The systems can be equipped with DC, RF and Pulsed DC power supplies to enable sequential or co-sputtering. The systems are pumped with a turbomolecular pumping package to achieve a base pressure of 5x10-7 Torr. Magnetron to substrate distance is adjustable in order to achieve desired uniformity and deposition rate. Rotating platen with off axis magnetrons provide means of achieving the best film uniformity. Crystal thick- ness monitor is provided for terminating process automatically. Substrate holders can be heated up to 800°C while rotating and RF biased.
SPUTTER System Feature and Option
FEATURES
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• Electro-polished 14” cubical chamber optimized for sputtering
• 5 x 10-7 torr base pressure attained with turbomolecular pumping package
• Single or multi magnetron configuration with varying cathode size • Sequential sputtering
• Adjustable magnetron to substrate distance
• 1” to 6” planar magnetron sizes
• Source and substrate shutters
• Mass flow controller with electro polished gas lines
• 4” viewport with manual shutter
• Quartz crystal thickness sensor
• Substrate rotation
• PC based fully automatic recipe or manually driven control system • State of the art user interface
• EMO protection and safety interlocks
OPTIONS
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• Substrate heating up to 800°C or cooling
• Glancing Angle Deposition (GLAD) with rotation
• Various chamber sizes
• 1.5-5Kw Pulsed DC power supply for ITO/ZnO like materials • Planetary substrate holder
• In-situ tilting for magnetrons
• RF biased substrate
• Ion source for substrate cleaning
• Ion assisted sputtering
• Additional power supplies (RF/DC) for co-sputtering
• Additional PVD sources (thermal, e-beam)
• Additional MFC’s for reactive sputtering
• Automatic load/unload
• Various pumping options including cryo pumping stations
APPLICATIONS
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• Optical coatings, and ITO Coatings • Decorative coatings
• Hard coatings
• Protective coatings
• Microelectronics patterning
SPUTTER System SPEC and Utilities
